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SPIE Proceedings [SPIE SPIE Europe Microtechnologies for the New Millennium - Dresden, Germany (Monday 4 May 2009)] Smart Sensors, Actuators, and MEMS IV - Adhesive wafer bonding using photosensitive polymer layers
Dragoi, Viorel, Schmid, Ulrich, Cakmak, Erkan, Capsuto, Elliott, McEwen, Craig, Pabo, EricVolume:
7362
Year:
2009
Language:
english
DOI:
10.1117/12.821725
File:
PDF, 1.03 MB
english, 2009