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[IEEE 2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) - Singapore, Singapore (2015.6.1-2015.6.4)] 2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) - Damage characterization study using piezoresistive stress sensors for wire bonding process
Hsiao, Hsiang Yao, Jaafar, Norhanani, Zhang, Xiaowu, Chai, Tai ChongYear:
2015
DOI:
10.1109/EDSSC.2015.7285194
File:
PDF, 587 KB
2015