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[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Flip chip power cycling system development and lead free bump power cycling reliability
Wu, Max K. C., Pan, H. Y., Lin, Larry, Chiu, Christine, Chou, Tulip, Lu, Gary, Liu, Patrick, Wu, Gene, Pu, H. P., Tsai, H. Y., Kiang, Bill, Wu, Kenneth, Lii, M. J., Yu, C. H.Year:
2012
DOI:
10.1109/ectc.2012.6248919
File:
PDF, 323 KB
2012