[IEEE 2010 2nd International Conference on Computer Engineering and Technology - Chengdu, China (2010.04.16-2010.04.18)] 2010 2nd International Conference on Computer Engineering and Technology - The reliability analysis of a micro-punching mold for IC packing bag
Lin, Wei-ShinYear:
2010
Language:
english
DOI:
10.1109/iccet.2010.5485740
File:
PDF, 503 KB
english, 2010