[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Analysis on the causes of decline of MLCC insulation resistance
Jiang, Wei, Hu, YongDa, Bao, ShengXiang, Lijie, Song, Yuwei, Zheng, Cui, Yongqiang, Qiang, LiYear:
2015
Language:
english
DOI:
10.1109/icept.2015.7236807
File:
PDF, 2.46 MB
english, 2015