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Applying material optimization to fracture mechanics analysis to improve the reliability of the plastic IC package in reflow soldering process
Geun Woo Kim,, Kang Yong Lee,Volume:
29
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2005.850512
Date:
March, 2006
File:
PDF, 454 KB
english, 2006