[IEEE 2010 IEEE International 3D Systems Integration Conference (3DIC) - Munich, Germany (2010.11.16-2010.11.18)] 2010 IEEE International 3D Systems Integration Conference (3DIC) - Equipment challenges and solutions for diverse temporary bonding and de-bonding processes in 3D integration
Gabriel, Markus, Bisson, Thomas Knauer Peter, Sood, Sumant, Bair, Wilfried, Hermanowski, JimYear:
2010
Language:
english
DOI:
10.1109/3dic.2010.5751478
File:
PDF, 644 KB
english, 2010