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[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - Characterization of local strain around trough silicon via interconnects in wafer-on-wafer structures
Nakatsuka, Osamu, Kitada, Hideki, Kim, Young Suk, Mizushima, Yoriko, Nakamura, Tomoji, Ohba, Takayuki, Zaima, ShigeakiYear:
2012
Language:
english
DOI:
10.1109/3dic.2012.6262971
File:
PDF, 412 KB
english, 2012