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[IEEE 2015 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2015.8.31-2015.9.2)] 2015 International 3D Systems Integration Conference (3DIC) - Copper-filled anodized aluminum oxide a potential material for chip to chip bonding
Yamashita, Kosuke, Kurooka, Shunji, Shirakawa, Koji, Hotta, Yoshinori, Abe, HirofumiYear:
2015
Language:
english
DOI:
10.1109/3dic.2015.7334589
File:
PDF, 1.99 MB
english, 2015