[IEEE 2015 Symposium on Design, Test, Integration and...

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[IEEE 2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Montpellier, France (2015.4.27-2015.4.30)] 2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - A compact packaging technique for the integration of ultrasound probes in surgical needles

Schiavone, Giuseppe, Desmulliez, Marc P.Y., Jones, Thomas, Price, Dennis, McPhillips, Rachael, Zhen Qiu,, Demore, Christine E.M., Cochran, Sandy, Mahboob, Syed O., Yun Jiang,, Meggs, Carl, Button, T
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Year:
2015
Language:
english
DOI:
10.1109/dtip.2015.7160970
File:
PDF, 551 KB
english, 2015
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