[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Correlation Between Package-level Ball Impact Test and Board-level Drop Test
Chang-Lin Yeh,, Yi-Shao Lai,, Hsiao-Chuan Chang,, Tsan-Hsien Chen,Volume:
1
Year:
2005
Language:
english
DOI:
10.1109/eptc.2005.1614405
File:
PDF, 4.47 MB
english, 2005