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[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Silver Glues and Lead-free Alloys in Die Attach of Power Devices

Gobbato, L., Scandurra, A., Tong Yan Tee,
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Volume:
1
Year:
2005
Language:
english
DOI:
10.1109/eptc.2005.1614422
File:
PDF, 2.68 MB
english, 2005
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