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[IEEE 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Grenoble, France (2015.5.18-2015.5.21)] 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Optimizing ULK film properties to enable BEOL integration with TDDB reliability
Ryan, E. Todd, Priyadarshini, D., Gates, S. M., Shobha, H., Chen, J., Virwani, K., Madan, A., Adams, E., Huang, E., Liniger, E., Collins, D., Stolfi, M., Yim, K. S., Demos, A., Grill, A.Year:
2015
Language:
english
DOI:
10.1109/iitc-mam.2015.7325597
File:
PDF, 168 KB
english, 2015