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[IEEE 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) - Brasov, Romania (2015.10.22-2015.10.25)] 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) - Metal particle filled, thermally conductive polymer composites for electronic packaging applications
Tavman, Ismail, Evgin, TubaYear:
2015
Language:
english
DOI:
10.1109/siitme.2015.7342290
File:
PDF, 1.03 MB
english, 2015