IEEE Transactions on Components Packaging and Manufacturing Technology Part C
1998 / 10 Vol. 21; Iss. 4
Use of compliant adhesives in the large area processing of MCM-D substrates
Wu, Jiali, Pike, Randy T., Wong, C. P.Volume:
21
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C
DOI:
10.1109/tcpmc.1998.7102529
Date:
October, 1998
File:
PDF, 2.89 MB
english, 1998