Use of compliant adhesives in the large area processing of...

Use of compliant adhesives in the large area processing of MCM-D substrates

Wu, Jiali, Pike, Randy T., Wong, C. P.
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Volume:
21
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C
DOI:
10.1109/tcpmc.1998.7102529
Date:
October, 1998
File:
PDF, 2.89 MB
english, 1998
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