![](/img/cover-not-exists.png)
[IEEE 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Paris, France (2015.9.30-2015.10.2)] 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Electro-thermo-mechanical modelling and analysis of the press pack diode in power electronics
Rajaguru, P., Lu, H., Bailey, C., Ortiz-Gonzalez, J., Alatise, O.Year:
2015
Language:
english
DOI:
10.1109/therminic.2015.7389607
File:
PDF, 843 KB
english, 2015