[IEEE 2010 IEEE International 3D Systems Integration Conference (3DIC) - Munich, Germany (2010.11.16-2010.11.18)] 2010 IEEE International 3D Systems Integration Conference (3DIC) - High density 3D integration by pre-applied Inter Chip Fill
Horibe, Akihiro, Sueoka, Kuniaki, Sakuma, Katsuyuki, Kohara, Sayuri, Matsumoto, Keiji, Kikuchi, Hidekazu, Orii, Yasumitsu, Mitsuhashi, Toshiro, Yamada, FumiakiYear:
2010
Language:
english
DOI:
10.1109/3dic.2010.5751461
File:
PDF, 286 KB
english, 2010