[IEEE 2004 54th Electronic Components and Technology Conference - Las Vegas, NV, USA (1-4 June 2004)] 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) - Underfill characterization for low-k dielectric / Cu interconnect IC flip-chip package reliability
Pei-Haw Tsao,, Chender Huang,, Mirng-Ji Lii,, Su, B., Nun-Sian Tsai,Year:
2004
Language:
english
DOI:
10.1109/ectc.2004.1319423
File:
PDF, 356 KB
english, 2004