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[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - A hybrid approach to characterize adhesion strength of interfaces in an organic substrate
Penmecha, Bharat, Alazar, Tsgereda, Seneviratne, Dilan, Liu, Pilin, Malatkar, PramodYear:
2015
Language:
english
DOI:
10.1109/ectc.2015.7159860
File:
PDF, 1.17 MB
english, 2015