[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Signal Integrity Analysis and Validation of GHz I/O Interface on Wire Bond Ball Grid Array Technology Package
Since, Huang Jimmy Huat, Lee Chan Kim,, Lee, Kuan ChinYear:
2006
Language:
english
DOI:
10.1109/emap.2006.4430589
File:
PDF, 3.17 MB
english, 2006