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[IEEE 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Chip-package co-design of power distribution network for system-in-package applications
Gawon Kim,, Dong Gun Kam,, Daehyun Chung,, Joungho Kim,Year:
2004
Language:
english
DOI:
10.1109/eptc.2004.1396659
File:
PDF, 230 KB
english, 2004