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[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Improvement of nickel wire bonding using Al nano coating
Klengel, Robert, Klengel, Sandy, Schischka, Jan, Lorenz, Georg, Petzold, MatthiasYear:
2014
Language:
english
DOI:
10.1109/estc.2014.6962852
File:
PDF, 2.16 MB
english, 2014