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Heat-resistant adhesive resins derived from bismaleimides and bisnadimides containing amide linkages
John A. Mikroyannidis, Anastasios P. MelissarisVolume:
37
Year:
1989
Language:
english
Pages:
15
DOI:
10.1002/app.1989.070370911
File:
PDF, 750 KB
english, 1989