![](/img/cover-not-exists.png)
[IEEE IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging - Scottsdale, AZ, USA (23-25 Oct. 2000)] IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) - Contact-pad design for high-frequency silicon measurements
Williams, D.F., Byers, A.C., Tyree, V.C., Walker, D.K., Ou, J.J., Xiaodong Jin,, Piket-May, M., Chenming Hu,Year:
2000
Language:
english
DOI:
10.1109/epep.2000.895510
File:
PDF, 277 KB
english, 2000