[IEEE IEEE 9th Topical Meeting on Electrical Performance of...

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[IEEE IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging - Scottsdale, AZ, USA (23-25 Oct. 2000)] IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) - Contact-pad design for high-frequency silicon measurements

Williams, D.F., Byers, A.C., Tyree, V.C., Walker, D.K., Ou, J.J., Xiaodong Jin,, Piket-May, M., Chenming Hu,
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Year:
2000
Language:
english
DOI:
10.1109/epep.2000.895510
File:
PDF, 277 KB
english, 2000
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