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[IEEE 2014 IEEE CPMT Symposium Japan (ICSJ) - Kyoto, Japan (2014.11.4-2014.11.6)] IEEE CPMT Symposium Japan 2014 - Electro-migration behavior in fine pitch SnBi eutectic solder bump interconnections
Murayama, Kei, Aizawa, Mitsuhiro, Kurihara, TakashiYear:
2014
Language:
english
DOI:
10.1109/icsj.2014.7009612
File:
PDF, 1.06 MB
english, 2014