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[IEEE 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2015.10.21-2015.10.23)] 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Challenge of 12″ CIS CSP development, explore via finite element method
Ni, Tom, Su, Scott, Cheng, Anna, Lu, Shirley, Su, Teddy, Chang, CC, Fang, David, Tai, JohnsonYear:
2015
Language:
english
DOI:
10.1109/impact.2015.7365196
File:
PDF, 893 KB
english, 2015