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[IEEE 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2015.10.21-2015.10.23)] 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Warpage characterization of glass interposer for BGA package application
Shih, Mengkai, Hsu, Charles, Yungshun Chang,, Chen, KarenYU, Kao, GoldenYear:
2015
Language:
english
DOI:
10.1109/impact.2015.7365243
File:
PDF, 950 KB
english, 2015