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Redistribution of pads on a singulated IC die using laser direct-write ablation
Chengping Zhang,, Bartholomew, R., Karulkar, P.C.Volume:
29
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2006.870393
Date:
March, 2006
File:
PDF, 1.19 MB
english, 2006