[ECS ISTC/CSTIC 2009 (CISTC) - Shanghai, China (March 19 - March 20, 2009)] ECS Transactions - Current Evolution of Wafer Thinning and Dicing
Sullivan, Scott M.Year:
2009
Language:
english
DOI:
10.1149/1.3096531
File:
PDF, 1.37 MB
english, 2009