![](/img/cover-not-exists.png)
[IEEE 2015 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2015.8.31-2015.9.2)] 2015 International 3D Systems Integration Conference (3DIC) - Development of high-quality low-temperature (≤ 120°C) PECVD-SiN films by organosilane
Taka, Hiroshi, Suzuki, Katsumasa, Tsujioka, Norihiro, Murakami, ShoichiYear:
2015
Language:
english
DOI:
10.1109/3dic.2015.7334600
File:
PDF, 1.10 MB
english, 2015