[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Peel test metrology for solder joint reliability of FCBGA packages
Jinlin Wang,, Lim, H.K., Lew, H.S., Woon Theng Saw,, Chew Hong Tan,Year:
2003
Language:
english
DOI:
10.1109/ectc.2003.1216301
File:
PDF, 529 KB
english, 2003