![](/img/cover-not-exists.png)
[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - The effect of micro-structure evolution in electromigration on the reliability of solder joints
Zhang, Jicheng, Xu, Yangjian, Liang, Lihua, Zhang, Yuanxiang, Liu, YongYear:
2015
Language:
english
DOI:
10.1109/icept.2015.7236729
File:
PDF, 10.18 MB
english, 2015