[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Numerical analysis and parameter optimization of thermal stress effect for low-k layer flip-chip with copper pillar bump
Yu, Huiping, Feng, Feng, Qin, Fei, Wu, Wei, An, Tong, Chen, PeiYear:
2015
Language:
english
DOI:
10.1109/icept.2015.7236799
File:
PDF, 1.90 MB
english, 2015