[IEEE 6th International Conference on Solid-State and IC Technology - Shanghai, China (22-25 Oct. 2001)] 2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443) - Fabrication of silicon-silicide-on-insulator substrates using wafer bonding and layer-cutting techniques
Shiyang Zhu,, Guoping Ru,, Yiping Huang,Volume:
1
Year:
2001
Language:
english
DOI:
10.1109/icsict.2001.981568
File:
PDF, 315 KB
english, 2001