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[IEEE 2014 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2014.12.15-2014.12.17)] 2014 IEEE International Electron Devices Meeting - High-precision wafer-level Cu-Cu bonding for 3DICs
Okada, Masashi, Sugaya, Isao, Mitsuishi, Hajime, Maeda, Hidehiro, Shimoda, Toshimasa, Izumi, Shigeto, Nakahira, Hosei, Okamoto, KazuyaYear:
2014
Language:
english
DOI:
10.1109/iedm.2014.7047118
File:
PDF, 870 KB
english, 2014