![](/img/cover-not-exists.png)
[IEEE 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2015.10.21-2015.10.23)] 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - High performances PPR copper plating for high aspect ratio boards
Wu, Weigang, Hung, Joyce, Lau, Sally, Zhang, Erhang, Hui, Gary, Li, Crystal, Yee, DennisYear:
2015
Language:
english
DOI:
10.1109/impact.2015.7365178
File:
PDF, 964 KB
english, 2015