Flip-Chip Interconnects for 250 GHz Modules

IEEE Microwave and Wireless Components Letters 2015 / 6 Vol. 25; Iss. 6

Flip-Chip Interconnects for 250 GHz Modules

Monayakul, Sirinpa, Sinha, S., Wang, C.-T., Weimann, N., Schmuckle, F. J., Hrobak, M., Krozer, V., John, W., Weixelbaum, L., Wolter, P., Kruger, O., Heinrich, W.
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Volume:
25
Language:
english
Journal:
IEEE Microwave and Wireless Components Letters
DOI:
10.1109/lmwc.2015.2424294
Date:
June, 2015
File:
PDF, 395 KB
english, 2015
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