[IEEE 2013 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2013.10.2-2013.10.4)] 2013 IEEE International 3D Systems Integration Conference (3DIC) - Eye-diagram simulation and analysis of a high-speed TSV-based channel
Kim, Heegon, Cho, Jonghyun, Kim, Jonghoon J., Jung, Daniel H., Choi, Sumin, Kim, Joungho, Lee, Junho, Park, KunwooYear:
2013
Language:
english
DOI:
10.1109/3dic.2013.6702327
File:
PDF, 1.05 MB
english, 2013