![](/img/cover-not-exists.png)
[IEEE 2000 50th Electronic Components and Technology Conference - Las Vegas, NV, USA (21-24 May 2000)] 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) - Under bump metallurgies for a wafer level CSP with eutectic Pb-Sn solder ball
Soon-Jin Cho,, Ji-Yon Kim,, Myung-Geun Park,, Ik-Sung Park,, Heung-Sup Chun,Year:
2000
Language:
english
DOI:
10.1109/ectc.2000.853260
File:
PDF, 821 KB
english, 2000