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[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Development of high yield, reliable fine pitch flip chip interconnects with copper pillar bumps and thin coreless substrate
Liu, Weidong, Xia, Guofeng, Liang, Tiansheng, Li, Taotao, Wang, Xiaolong, Xie, Jianyou, Chen, Shiguang, Yu, DaquanYear:
2015
Language:
english
DOI:
10.1109/ectc.2015.7159828
File:
PDF, 1019 KB
english, 2015