[IEEE Electrical Performance of Electronic Packaging - Portland, OR, USA (25-27 Oct. 2004)] Electrical Performance of Electronic Packaging - Modeling of semiconductor substrate on on-chip power grid switching
Jae-Yong Ihm,, Cangellaris, A.C.Year:
2004
Language:
english
DOI:
10.1109/epep.2004.1407606
File:
PDF, 264 KB
english, 2004