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[IEEE 2006 1st Electronic Systemintegration Technology Conference - Dresden, Germany (2006.09.5-2006.09.7)] 2006 1st Electronic Systemintegration Technology Conference - A New Method of Flip Chip Assembly Using a Light Silver Filled Glue
Feil, Michael, Konig, Martin, Bock, KarlheinzYear:
2006
Language:
english
DOI:
10.1109/estc.2006.280055
File:
PDF, 3.75 MB
english, 2006