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[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Improved low temperature gold-gold bonding using nanoporous powder bump using vacuum ultraviolet irradiation pre-treatment
Kaneda, Tatsushi, Mizuno, Jun, Okada, Akiko, Matsunaga, Kaori, Shoji, Shuichi, Saito, Mikiko, Nishikawa, HiroshiYear:
2015
Language:
english
DOI:
10.1109/icep-iaac.2015.7111061
File:
PDF, 927 KB
english, 2015