[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Effect of electromigration of Sn-xAg-Cu solder joints on its microstructure and mechanical properties
Tian, Shuang, Wang, Fengjiang, Li, Dongyang, Wang, Fengjiang, He, PengYear:
2015
Language:
english
DOI:
10.1109/icept.2015.7236588
File:
PDF, 715 KB
english, 2015