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[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Interfacial microscopic reaction mechanism of lead-free attachment material in IGBT packaging
Xu, Hongyan, Wang, Chunlei, Zheng, Libin, Fang, Huachao, Xu, JuYear:
2015
Language:
english
DOI:
10.1109/icept.2015.7236861
File:
PDF, 666 KB
english, 2015