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[IEEE 7th International Conference on Solid-State and Integrated Circuits Technology, 2004. - Beijing, China (Oct. 18-21, 2004)] Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004. - The effect of pretreatment process on electroless nickel bumping for different al pads

Xiao-Chen Fu,, Guo-Wei Xiao,, Pui-Chung Law,, Chan, P.C.H.
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Volume:
1
Year:
2004
Language:
english
DOI:
10.1109/icsict.2004.1435078
File:
PDF, 1.12 MB
english, 2004
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