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[IEEE 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2015.10.21-2015.10.23)] 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - The electrical characterizations of glass interposer for integrated reliability test
Lee, Ching-Kuan, Wang, Jen-Chun, Lin, Yu-Min, Zhan, Chau-Jie, Shen, Wen-Wei, Fu, Huan-Chun, Lee, Yuan-Chang, Chiang, Chia-Wen, Chung, Su-Ching, Chen, Su-Mei, Fan, Chia-Wen, Lo, Wei-Chung, Lu, Yung JeaYear:
2015
Language:
english
DOI:
10.1109/impact.2015.7365220
File:
PDF, 1.10 MB
english, 2015