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[IEEE 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Hsinchu (2015.6.29-2015.7.2)] 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits - New method for chemical characterization of polymer materials in industrial devices : AFM-IR with FIB sample preparation
Baden, Naoki, Yasuda, Mitsunobu, Yoshida, Akiyo, Muraki, NaokiYear:
2015
Language:
english
DOI:
10.1109/ipfa.2015.7224441
File:
PDF, 414 KB
english, 2015