[IEEE The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems - Las Vegas, NV, USA (1-4 June 2004)] The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) - Experimental method of measuring C4 die bump temperature for electronics packaging
Chau, D.S., Chia-Pin Chiu,, Torresola, J., Prstic, S., Reynolds, S.Year:
2004
Language:
english
DOI:
10.1109/itherm.2004.1319159
File:
PDF, 447 KB
english, 2004