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[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - High reliability 2.5 Gbit/s modules using silicon platform technology
Reygrobellet, J.N., Volto, P., Hernandez, Y., Berthier, P., Samson, Y., Viala, A., Coquelin, A., Tournereau, A., Lecocq, V., Lievre, L., Laffine, D.Year:
2003
Language:
english
DOI:
10.1109/ectc.2003.1216290
File:
PDF, 529 KB
english, 2003